GE IS215ACLEH1BB MarkVI RTD CARD 高速电子RTD卡
高集成度设计:转发NP(Network Processor,网络处理器)芯片率先集成400GE MAC层,直接与光模块对接,相对外置400GE MAC层芯片模式,功耗降低超过30%;
的50G PAM4技术:作为50G PAM4产业的引领者,创新性地把50G PAM4编码技术引入400GE光模块系统,传输效率提高一倍,相比100GE光模块单比特成本降低30%;
基于QSFP-DD全场景光模块:采用新一代基于QSFP-DD高密高速封装技术,相对上一代CFP8封装尺寸减少2/3,功耗下降15%以上;传输距离支持100米、500米、2km、10km、40km,可以覆盖骨干网、城域网和数据中心全部的应用场景,满足灵活场景部署需求。
Highly integrated design: The NP chip is the first to integrate the 400GE MAC layer and directly interconnect with optical modules. Compared with the external 400GE MAC layer chip mode, the power consumption is reduced by more than 30%.
Leading 50G PAM4 technology: As the leader of the 50G PAM4 industry, it innovatively introduced 50G PAM4 coding technology into the 400GE optical module system, doubling the transmission efficiency and reducing the single-bit cost of 100GE optical modules by 30%;
QSFP-DD based all-scenario optical module: adopts the new QSFP-DD based high-density high-speed packaging technology, which reduces the package size by 2/3 and power consumption by more than 15% compared with the previous generation CFP8. The transmission distance supports 100 m, 500 m, 2km, 10km, and 40km, covering all application scenarios of the backbone network, metropolitan area network, and data center, meeting deployment requirements in flexible scenarios.




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