GE DS3800HFPG1D1D 具有用于连接到驱动器的模块化
产品描述
GE驱动控制板DS3800HFPG1D1D具有用于连接到驱动器的模块化连接器和固定杆,用于将驱动器固定在驱动器中。GE驱动控制板DS3800HFPG1D1D还装有微处理器和多个可擦除可编程只读(EPROM)模块。该板有 1 个 34 针连接器,可从板的正面访问。它还在电路板表面装有测试点和 1 个 40 引脚连接器。
电路板上的另一个组件是晶体管到晶体管逻辑 (TTL) 器件。它用作集成电路之间的接口逻辑。
GE驱动控制板上的微处理器DS3800HFPG1D1D在板处理时产生热量。如果让热量在驱动器内部积聚,可能会损坏组件或导致组件的使用寿命缩短。安装程序可以采取一些措施来防止微处理器产生的热量积聚。
将所有电缆远离驱动器上的通风口。通风口必须允许空气自由流动。驱动器底部有通风口,可使冷空气进入驱动器。驱动器顶部有排气孔,可排出热空气。将驱动器安装在有冷空气供应的位置。此外,将驱动器安装在触感凉爽且不会被另一侧设备加热的墙上。
如果热量积聚,可能会触发过热跳闸情况。这会导致驱动器自动关闭并结束所有处理。
GE DS3800HFPG1D1D 具有用于连接到驱动器的模块化
Product description
The GE Drive control board DS3800HFPG1D1D has a modular connector for connection to the drive and a retainer rod for securing the drive in the drive. The GE drive control board DS3800HFPG1D1D also houses a microprocessor and multiple erasable programmable read-only (EPROM) modules. The board has a 34-pin connector that can be accessed from the front of the board. It also has test points and a 40-pin connector on the board surface.
Another component on the board is a transistor-to-transistor logic (TTL) device. It serves as the interface logic between integrated circuits.
GE drives the microprocessor DS3800HFPG1D1D on the control board to generate heat when the board is processed. If heat is allowed to build up inside the drive, it can damage the component or lead to a shortened service life of the component. The installer can take some steps to prevent the buildup of heat generated by the microprocessor.
Keep all cables away from the vents on the drive. The vents must allow air to flow freely. There are vents at the bottom of the drive that allow cold air to enter the drive. There are vents at the top of the drive to expel hot air. Install the drive in a location with cold air supply. In addition, mount the drive on a wall that feels cool to the touch and will not be heated by the device on the other side.
If heat builds up, a superheat trip condition may be triggered. This causes the drive to shut down automatically and end all processing.
GE DS3800HFPG1D1D 具有用于连接到驱动器的模块化
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