XVC722AE101 ABB 主控板为驱动器的控制中枢

XVC722AE101 ABB  主控板为驱动器的控制中枢

主控板为驱动器的控制中枢，包括控制电源、调制脉冲的产生、控制方式及保护逻辑等四部分电路。它接受来自面板和外控接口的信号，控制和保护射频单元的工作，同时它把驱动器运行的状态信号输到面板和外控接口。

IGBT主控板主要以高频感应加热主控制板和两个驱动为主，高频板技术采用了SG3525A作为PWM脉冲形成，输出脉冲频率范围20KHZ—60KHZ,脉冲间隔互为180度，死区时间可以自行调整。可适用于IGBT全桥逆变串联谐振感应加热装置用斩波器调压调功。

IGBT高频控制板，主要采用SG3525A作为PWM脉冲形成，输出脉冲频率范围20KHz—60KHz，脉冲间隔互为180度，死区时间可以自行调 整。可适用于IGBT全桥逆变串联谐振感应加热装置调频调功。

功率范围：10KW—120KW，该控制板接线少，控制集中，无须调试，工作电源电压为三路 交流双18V/1A及四个22V/0.5A的电源。

具有过流，过压，却水，多种状态指示，并提供开关型霍尔保护接口和线性霍尔保护接口，有全桥逆变 IGBT驱动电路，此板可直接组装IGBT高频感应加热装置。

典型的主板能提供一系列接合点，供处理器、显卡、声效卡、硬盘、存储器、对外设备等设备接合。它们通常直接插入有关插槽，或用线路连接。主板上zui重要的构成组件是芯片组（Chipset）。而芯片组通常由北桥和南桥组成，也有些以单片机设计，增强其性能。这些芯片组为主板提供一个通用平台供不同设备连接，控制不同设备的沟通。它亦包含对不同扩充插槽的支持，例如处理器、PCI、ISA、AGP，和PCI Express。芯片组亦为主板提供额外功能，例如集成显核，集成声效卡（也称内置显核和内置声卡）。一些高价主板也集成红外通讯技术、蓝牙和802.11（Wi-Fi）等功能。

XVC722AE101 ABB  主控板为驱动器的控制中枢

The main control board is the control center of the driver, including control power supply, modulation pulse generation, control mode and protection logic. It accepts the signal from the panel and the external control interface, controls and protects the work of the RF unit, and it transmits the status signal of the driver operation to the panel and the external control interface.

The IGBT main control board is mainly composed of high frequency induction heating main control board and two drivers. The high frequency board technology adopts SG3525A as PWM pulse formation, the output pulse frequency range is 20Khz-60khz, the pulse interval is 180 degrees each other, and the dead time can be adjusted by itself. It can be applied to voltage and power regulation by chopper of IGBT full-bridge inverter series resonant induction heating device.

The IGBT high-frequency control board mainly adopts SG3525A as PWM pulse formation, the output pulse frequency range is 20Khz-60khz, the pulse interval is 180 degrees each other, and the dead time can be adjusted by itself. It can be applied to frequency and power regulation of IGBT full-bridge inverter series resonant induction heating device.

Power range: 10kwe-120kW, the control board less wiring, centralized control, no need to debug, the working power supply voltage for three AC double 18V/1A and four 22V/0.5A power supply.

With over current, over voltage, but water, a variety of state indicators, and to provide switching type Hall protection interface and linear hall protection interface, a full bridge inverter IGBT drive circuit, this board can be directly assembled IGBT high frequency induction heating device.

A typical motherboard can provide a series of bonding points for the processor, graphics card, sound card, hard disk, memory, external equipment and other devices to engage. They are usually inserted directly into the relevant slot or connected by a wire. The most important component on a motherboard is the Chipset. The chipset usually consists of a north bridge and a south bridge, and some are designed with a single chip microcomputer to enhance their performance. These chipsets provide a common platform for the motherboard to connect different devices and control the communication between different devices. It also includes support for different expansion slots, such as processors, PCI, ISA, AGP, and PCI Express. The chipset also provides additional features for the motherboard, such as integrated display core, integrated sound card (also known as built-in display core and built-in sound card). Some expensive motherboards also integrate infrared communication technology, Bluetooth, and 802.11 (Wi-Fi).