1769-HSC 是一款紧凑型 I/O 模块

1769-HSC 是一款紧凑型 I/O 模块

Allen-Bradley 1769-ARM 模块保留并替换了模块插槽。在创建 I/O 配置和用户程序（删除该模块的所有进一步配置）后，它开始运行。1769-ARM 模块占用的插槽位置的程序引用不得使用其他模块的参数。1769-ARM 具有 1 字输入数据文件，但没有输出，也没有配置数据文件。

1769-ARM的电流消耗为60 mA（5.1 V）。zui大散热W0.3W，供电距离额定值8。它重约 0.62 磅，近似尺寸为 118 x 35 x 87 毫米。当与卡舌一起安装时，它可以变成 138 毫米高。该模块可以安装在DIN导轨或面板上。其兼容的电源为 1769-PA2、1769-PB2、1769-PA4、1769-PB4，该模块具有开放式外壳类型额定值。

1769-ARM 模块的工作温度为 32-140 °F。它的储存温度为 -40 至 185° F，相对湿度为 5-95%。它在 10-500 Hz 时具有 5g 的zui大峰峰值工作振动和 2g 继电器操作。它具有 30G 面板安装操作冲击（20G DIN 导轨安装）和 7.5G 面板安装操作冲击（5G DIN 导轨安装）。它还具有 40G 面板安装（30G DIN 导轨安装）非工作冲击。1769-ARM 的辐射和传导发射被归类为 EN 50081-2 A 类。

1769-HSC 是一款紧凑型 I/O 模块

The Allen-Bradley 1769-ARM module retains and replaces the module slot. After creating the I/O configuration and user program (removing all further configurations for that module), it starts running. 1769-Program references to slot locations occupied by ARM modules must not use parameters of other modules. The 1769-ARM has a 1-word input data file, but no output and no configuration data file.

The current consumption of the 1769-ARM is 60 mA (5.1 V). Maximum heat dissipation W0.3W, power supply distance rating 8. It weighs about 0.62 pounds and has an approximate size of 118 x 35 x 87 mm. When installed with the card tongue, it can become 138 mm high. The module can be mounted on a DIN rail or panel. Compatible power supplies are 1769-PA2, 1769-PB2, 1769-PA4, 1769-PB4, and the module has an open housing type rating.

The 1769-ARM module operates at 32-140 °F. It has a storage temperature of -40 to 185° F and a relative humidity of 5-95%. It has a maximum peak-to-peak operating vibration of 5g and relay operation of 2g at 10-500 Hz. It has a 30G panel mount operating impact (20G DIN rail mount) and 7.5G panel mount operating impact (5G DIN rail mount). It also has a 40G panel mount (30G DIN rail mount) non-working impact. Radiative and conducted emissions from 1769-ARM are classified as EN 50081-2 A.